ligitek electronics co.,ltd. property of ligitek only dual color led lamps lead-free parts LURFDGM15592 data sheet pb doc. no : qw0905-lurfdgm 15592 rev. : a date : 03 - jul. - 2009 l dcc
page 1/6 ligitek electronics co.,ltd. property of ligitek only part no. LURFDGM15592 package dimensions note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 2.54typ 2.54typ 1.anode green 2.common cathode 3.anode red + - + 2 1 3 7.0 9.0 ? 0.5 18.0min 0.5 typ 1 2 3 2.0min 1.5max 5.0 5.0 dgm urf 2.0min 25% -60 x 75% 100% 25% 50% 0 directivity radiation 0 x -30 x 60 x 75% 50% 100% 30 x
* static electricity or power surge will damage the led. use of a c onductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. ligitek electronics co.,ltd. property of ligitek only unit dgm urf symbol parameter ratings absolute maximum ratings at ta=25 j ma mw 100 130 120 120 g a v 50 10 2000 i fp pd power dissipation peak forward current duty 1/10@10khz ir esd electrostatic discharge( * ) reverse current @5v forward current i f ma 30 50 page 2/6 j -30 ~ +100 tstg storage temperature typical electrical & optical characteristics (ta=25 j ) note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. operating temperature -20 ~ +80 t opr j material algainp ingan/gan LURFDGM15592 part no peak wave length f dnm spectral halfwidth ??f nm forward voltage @20ma(v) viewing angle 2 c 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length f dnm --- red 630 white diffused green 518 525 lens color emitted --- 20 160 90 2.6 140 1.7 350 36 3.5 4.0 --- 550 140 min. min. typ. max. typ. 500 part no. LURFDGM15592
ligitek electronics co.,ltd. property of ligitek only typical electro-optical characteristics curve urf chip page 3/6 1.0 forward voltage@20ma normalize @25 j relative intensity@20ma normalize@25 j 40 ambient temperature( j ) 650 700 550 600 wavelength (nm) ambient temperature( j ) fig.5 relative intensity vs. wavelength 1.0 0.5 relative intensity@20ma 0 0.9 0.8 -0 -40 -20 20 40 60 80 100 0 -40 -20 0.5 -0 20 60 80 100 fig.2 relative intensity vs. forward current forward current(ma) fig.4 relative intensity vs. temperature 3.0 forward current(ma) forward voltage(v) fig.3 forward voltage vs. temperature 1.2 1.1 1.0 10 1.0 0.1 100 1.0 1.5 2.0 1.5 2.0 2.5 3.0 relative intensity normalize @20ma 3.0 2.5 1.0 1.0 0.5 0 10 2.0 1.5 2.5 fig.1 forward current vs. forward voltage 1000 3.5 1000 100 part no. LURFDGM15592
relative intensity@20ma normalize @25 j forward voltage@20ma normalize @25 j wavelength (nm) -20 500 relative intensity@20ma 0.0 450 0.5 550 600 ambient temperature( j ) fig.5 relative intensity vs. wavelength 1.0 -20 0 -40 0.8 80 40 60 20 -40 100 0.0 0.5 ambient temperature( j ) 40 20 60 080100 relative intensity normalize @20ma forward current(ma) 100 fig.4 relative intensity vs. temperature fig.3 forward voltage vs. temperature 1.0 0.9 1.1 1.2 2.5 1.5 1.0 2.0 3.0 forward voltage(v) 1.0 0.1 2.0 1.0 10 0.5 3.0 4.0 5.0 0.0 1.0 1.0 2.0 1.5 forward current(ma) 10 100 1000 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve fig.1 forward current vs. forward voltage 1000 dgm chip 3.0 2.5 4/6 page part no. LURFDGM15592
page 5/6 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260c3sec max 260x temp( c) 2 /sec max 100 50 preheat 120x 25x 0 0x note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2c/sec(max) ramp-down:-5 c/sec(max) solder bath:260c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max part no. LURFDGM15592
1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test high temperature high humidity test thermal shock test 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. solder resistance test mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) high temperature storage test 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) reliability test: operating life test test condition test item mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard page 6/6 part no. LURFDGM15592
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